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World Electric Vehicle Day is here, and, as an industry analyst, it presents a great occasion to take a retrospective look at the past decade of innovation and disruption.

To mark National Aviation Day, a celebration of the history and development of aviation, IDTechEx analysts consider the future of electric aircraft.

Whilst IDTechEx expects EVs to continually improve in safety, there will always be the risk of a battery fire due to many potential causes. This presents an opportunity for those material suppliers making thermal interface materials (TIMs), flame-retardant materials, or fire protection materials.

Thursday 22 July 2021 - Shifting Thermal Management Strategies. Thermal management of electric vehicles is a key consideration for range, performance, lifetime and safety of EVs. There are several key trends within the EV market, several of which will change the materials, designs and markets for thermal management.

A host of batteryless solutions have recently been announced. The rapid increase in adoption of batteryless solutions is tracked in the IDTechEx report, "Battery Elimination in Electronics: Market Impact IoT, 6G, Healthcare, Wearables 2021-2041".

Here come 600-mile electric cars and they will grab market share even as city cars. At last, you will be able to buy a car that lets you vacation in it wherever you wish.

Within the EV market, increases are being seen in battery capacity, range, charging rates, wide bandgap semiconductors, and high-performance traction motors. Additionally, EV fires and related recalls have brought the concept of thermal runaway detection, prevention, and protection to the fore. All of these trends demand more effective thermal management systems, solutions, and materials.

Advanced formulation designed to improve reliability and productivity for power semiconductor die attach

Would you prefer a car with 600 miles/nearly 1000km range or half that? Fast charging is all the talk now but doubling then trebling the range is seismic.

Advanced formulation designed to improve reliability and productivity for power semiconductor die attach